© Fraunhofer IKTS
For many years now, miniaturization has been the main driver of the electronics industry. This is particularly true for ceramic-based circuit boards, which have properties that make them especially suitable for high-frequency circuits. Increasingly demanding technical requirements have exposed the limits of the classic thick-film technologies used for the production of circuit-board conductors. Now, however, a new generation of thick-film pastes and their photolithographic structuring enable the manufacturing of extremely high-resolution thick-film structures necessary for 5G applications. Moreover, this process is suitable for mass production and industrial applications while maintaining low investment costs and only minimally extending production times. Researchers from the Fraunhofer Institute for Ceramic Technologies and Systems IKTS exhibit the new pastes at the Productronica trade fair in Munich from November 12 to 15 (Hall B2, Booth 228).